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It is a Y-shaped vacuum suction chuck.
It is suitable for transporting 300mm wafer sizes (random access compatible). It is widely used in atmospheric environment robots and holds the back surface of the workpiece by vacuum suction (negative pressure). By applying a conductive Teflon coating to the chuck surface, it prevents the transported workpieces from damage and scratches caused by static electricity.
Please use for processing thin non-magnetic materials (such as aluminum, stainless steel, plastic, etc.) on machining, milling, and grinding machines.
Compressed air from the compressor in the factory can be utilized, so a vacuum pump is not necessary. Drilling can be done using a sub-plate. It has key grooves on the bottom surface, ensuring accurate parallelism and perpendicularity. It is convenient for finishing the top and bottom surfaces with grinding.
